Our company's silicon free release film is composed of polymer materials and is made through a unique formula and strict process. The surface of the product is white, without any coating, and has excellent physical and mechanical properties, chemical stability, and surface release stability. It is the most ideal high-temperature release material for the production of FPC lamination process and can be widely used in FPC lamination, soft hard bonding board lamination, HDI lamination, PCB mirror panel lamination.

Features:

The surface of the film is white, smooth and free of foreign objects.
There is no coating layer on the surface of the release film.
Stable release force.
Resistant to fast pressure transmission temperature.
No foreign objects remain after compression.

Purpose:

FPC CVL lamination: This silicon free release film with a thickness of 50um can control CVL overflow within 0.07mm.
FPC reinforcement and compression: For products with surface coating treatment on the circuit board, after using this silicon free release film, there will be no substance residue on the surface of the product.
PCB mirror panel pressing: After pressing, the mirror surface can maintain its original brightness without any material residue causing the mirror surface to lose light.

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